Wafer-bonding Expert Process Engineer

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Our Swedish based client is currently searching for a Wafer-bonding Expert Process Engineer to lead and improve the overall process portfolio within the wafer bond area of the fab. The role will involve training and coaching of engineering team members as well as working with service engineers and operators to achieve manufacturing goals. Developing and improving wafer bonding processes will be key, as well as participating in the start-up of new products and review specifications. Required skills for the Wafer-bonding Process Expert will include:15+ years’ experience within Semiconductor industry10+ years’ experience in wafer bondingMEMS knowledge is beneficialExpert in Thermo compression/Eutectic wafer bonding is preferred Language: Fluent English (spoken and in writing) is requiredDegree in Physics, Materials, Electronics or equivalentPlease contact Rachel Anderson for further details.