Electroplating/PVD Process Engineer
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Our international client is currently searching for a Senior Back-end Electroplating Process Engineer to be responsible for providing process expertise to fab process teams and partner fabs to improve cycle time, yield and quality of metallization and bonding processes. The role will involve owning the whole metallization and solder bump process across the line, as well as the use of statistics for experimental design (DOE) and process control (SPC) to allow data driven decisions to be recommended. Required skills for the Senior Backend Process Engineer will include:Strong semiconductor fab process knowledgeBackend metallization/solder bump process experiencePVD/Electrochemistry equipment knowledge and statistical process experienceStrong communications skillsBachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics or equivalentPlease contact Rachel Anderson for further details.