Lead RF IC Design Engineer - SATCOM
20th November 2023
£85000 - £100000
This job has now expired please search on the home page to find live IT Jobs.An exciting opportunity has arisen to join an expanding company working developing high tech communications and radar technologies. In this role you will have the opportunity to work on antenna technology to serve markets including; broadband mobility, satellite communications and Internet of Things (IoT). As the Lead Principal Analog/RF IC Design Engineer/Head of ASIC Design, you will be responsible for leading the design of Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for next generation of satellite communications and will be responsible for delivery of ASIC Specifications, architecture design, circuit design & verification, review, IC qualification & production release. In this role you will have the opportunity to be at the helm of ASIC development where you will develop new circuit architectures, design/verification methodologies to deliver ASICs that meet all the performance requirements in the required timeline. While the job primarily involves you to own and lead the chip-level development, you will work closely with the block-level design and layout engineers to conduct technical reviews and provide guidance and direction for successful delivery. You will also work closely with the test team in developing the test plan and characterising the ASIC. You will be leading and mentoring a team of RF IC Design engineers and will work closely across the organisation from layout & test teams to systems, antenna, hardware teams to ensure on-time delivery of leading ASICs. You will also assist in choosing the fabrication process & technology vendors, setup process flow and ensuring design governance, create product development plans and technology roadmaps. Industry degree qualified you will have a minimum of 10 years of experience in the design of RF ICs in deep sub- micron technologies (preferably 15GHz or higher operating frequencies) with chip lead experience in 2 or more successful tape-outs. Responsibilities Include:
ASIC specifications, architecture design, top level design & verification, block level designs and on-time tape-out of ASICs.Design of transmitter & receiver blocks in Ku/Ka band in deep sub- micron CMOS technologies.Hands-on block-level design of various RF blocks such as PA, LNA, VGA, Phase shifters, Power Splitters/combiners.Delivering high quality RF/Analog blocks with leading edge performance using innovative architectures and circuit implementations.Co-ordinate and manage design activities with other colleagues.Collaborate with CAD, process technology, package design, Antenna & hardware teams.Document own work and lead design reviews.Experience is desired in 22nm FDSOI or other sub 45nm CMOS process nodes for RF/High speed ICs and/or experience in mmW/RF IC design, LNA design and RF PAs.Excellent communication skills are required as well as the ability to take responsibility for complex circuit and system designs within delivery timescales. You will have the ability to interact with engineering teams across multiple disciplines during ASIC project stream development. Contact Leon to apply and find out more.