Advanced Packaging Engineer

Premium Job From IC Resources


IC Resources

Listed on

7th November 2023




£80000 - £95000



Start Date


This job has now expired please search on the home page to find live IT Jobs.

Our Grenoble based client is currently searching for an Advanced Packaging Engineer to join silicon photonic chip packaging team. The role will involve designing advanced packaging solutions for silicon photonic ICs and taking them from design to mass production. Identifying and managing subcontractors will be an important part of the role, as well as interaction with customers to ensure product requirements are met. Required skills for the Advanced Packaging Engineer will include:
Strong advanced semiconductor packaging knowledgeMicro-optical or fibre optic assembly process experienceSemiconductor assembly processes such as flip-chip and wire-bond manufacturing flowStrong communication skillsPhD, engineering school or master's degree Physics, Electrical Engineering, or Electronics Engineering Please contact Rachel Anderson for further details.

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