IC Packaging Design and Simulation Engineer
Recruiter
IC Resources
Listed on
20th January 2022
Location
Northampton
Salary/Rate
£45000 - £60000
Type
Permanent
Start Date
2021-10-18
This job has now expired please search on the home page to find live IT Jobs.
Our international client is currently searching for an IC packaging, Design and Simulation Engineer to be responsible for new package design and design simulation. The role will involve modelling and analysing new substrate designs as well as optimising mechanical and thermal requirements. Solving and enhancing PI (power integrity) and SI (signal integrity) designs will be required. This role can be based in multiple locations including the UK, Switzerland, Taiwan and Germany. Required skills for the IC Packaging Engineer will include:Semiconductor IC package design experienceSignal integrity /power integrity knowledgeExperience with high volume semiconductor manufacturingStrong communication skillsDegree in Electrical Engineering and/or Materials Science and/or Mechanical Engineering is preferredPlease contact Rachel Anderson for further details.