Semiconductor Packaging Applications Engineer


Premium Job From IC Resources

Recruiter

IC Resources

Listed on

10th January 2022

Location

Germany

Salary/Rate

£70000 - £90000

Type

Permanent

Start Date

2022-01-10

This job has now expired please search on the home page to find live IT Jobs.

Our international client is currently searching for a Semiconductor Packaging Applications Engineer to be responsible for package design and analysis of EDA tools. The role will involve researching best practice package design methodologies for key customers and to analyse package designs with regards to signal and power integrity. Training key customers on advanced packages will be required as well as optimising designs for electrical performance.  You will be part of a global packaging team and the role can be based anywhere in Europe/UK with occasional travel. Required skills for the Semiconductor Packaging Application Engineer will include:
Strong IC package design experience (Cadence Allegro, APD or SiP tools)Signal and power integrity experienceStrong English language skillsDegree in micro-electronics/physics or equivalentPlease contact Rachel Anderson for further details.

You are currently using an outdated browser.

Please consider using a modern browser such as one listed below: