3D Integration Process Engineer

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IC Resources is currently working with a multinational corporation and searching for a 3D Integration Process Engineer to contribute to the definition of the 3D integrated system technology roadmap, and to support the transfer of new technologies from R&D to production. The role will require communicating to colleagues across multiple international sites.

Required experience for the 3D Integration Process Engineer will be as follows,

In-depth knowledge of semiconductor process technology, 3D integration technologies (WLCSP, TSV) TCAD knowledge beneficial Yield improvement and technology transfer skillsExcellent communication skillsEngineering Degree in Electronic Engineering / Physics or equivalent

Please contact Rachel Anderson to discuss further