Principal IC Manufacturing Test Engineer - £60,000 - Reading

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Key Words: IC, Production, Test, Manufacturing, Hardware, Software, RF, Teradyne, UltraFlex, Verigy, LTX, STDF, Wifi, Wimax, LTE, Wafer, Analogue.

I have just been instructed to recruit a Principal IC Manufacturing Test Development engineer for a well established technology company based in Reading. The company are looking for somebody to come in a lead engineer to manage a Production test engineer, and help drive projects.

Role: Principal IC Manufacturing Test Development Engineer

Salary: £60,000 + Benefits

Location: Reading

The Role:

* Technical and project lead overseeing the project planning and execution, including managing the day to day activities of another Senior Production Test Engineer.

* Set the direction for a flexible test platform to support our next generation products.

* Create the Production Test Plan for both RF and BBIC chips.

* Successful integration of the Production test plan, software and hardware into high volume manufacturing facility in the Far East. Some travel required.

* Includes tester platform selection, HW and Software development and off-shore transfer to Assembly and Test House (OSAT).

* Evaluation of system performance and compliance with specifications and customer requirements.

* Responsible for testing and evaluating chips returned from customers as well as productivity improvements in yield and cost.

Key Skills:

* Engineering degree in a relevant discipline. BSc, MSc or equivalent

* 10 to 15 years experience of relevant IC Production Test development.

* Experience in leading, managing and planning others day to day work on a project.

* Production Tester HW and Software development experience on testers such as Teradyne UltraFlex, Verigy, LTX, etc… is a must.

* Recent successful RF and digital factory introductions of highly complex RF transceivers and/or digital baseband chips, ideally related to broadband wireless communication systems, e.g. WiFi, WiMax or LTE, on a nano-metre scale RF-CMOS technology

* Statistical analysis capabilities as well as the manipulation of STDF files.

Desirable Skills:

* Experience in wafer level analog and/or RF testing

* WLCSP with narrow bump pitch (